Sr. Process Engineer, Chemical Mechanical Planarization

Gangnam-gu, Seoul, South Korea · Engineering · AI

Company: Make physical products work through software, factories, suppliers and service.
Role: Develop CMP and post-CMP cleaning; control removal rates, flatness and defects.

What you will do

We rewrote the responsibilities and qualifications in plain language instead of copying the original posting.

Develop and qualify CMP for STI, ILD, metals and barriers across interconnect levels and concurrent product flows.
Optimize removal, uniformity, planarization and surface finish through DOE and first-principles analysis of pads, slurries and conditioning.
Qualify post-CMP brush scrubbing and chemical cleaning.
Qualify tools from installation through production readiness, including conditioning, slurry delivery and endpoint detection.
Drive root-cause analysis, inline metrology, SPC, yield improvement and next-generation slurry and process development.
Support round-the-clock manufacturing through rotations, on-call availability and urgent responses.

A BS or MS in chemical engineering, materials science, electrical or mechanical engineering or a related technical field is required.
At least five years of fab CMP experience, especially below 7 nm in logic, memory or foundry, is required.
Deep experience with CMP tool qualification, slurry and pad optimization and advanced-node POR establishment is required.
Use film, defect, AFM and dishing/erosion metrology and DOE and statistical analysis with JMP, Python or R.
Work proactively with lithography, etch, thin-film, integration and equipment teams.

Read the employer’s original job description

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Checked 2026-10-19

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