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Tesla company · OPEN ROLE
- Company
- Make physical products work through software, factories, suppliers and service.
- Role
- Develop plasma/atomic-layer etch; control profiles, dimensions and selectivity at 2nm-class nodes.
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What you will do
We rewrote the responsibilities and qualifications in plain language instead of copying the original posting.
Responsibilities
- Develop and qualify plasma etch for 2 nm-class gates, spacers, contacts and interconnects.
- Develop atomic-layer etch for angstrom-level profile and selectivity control.
- Optimize profiles, CD, uniformity and selectivity using plasma chemistry and etch physics.
- Qualify tool readiness through chamber seasoning, plasma characterization and process windows.
- Analyze process physics and lead root-cause analysis, inline metrology, SPC and yield improvement.
- Support round-the-clock manufacturing through rotations, on-call availability and urgent responses and develop next-generation materials and processes.
What you need
- A BS or MS in chemical engineering, materials science, electrical engineering or physics or a related technical field is required.
- At least five years of hands-on fab dry-etch experience, especially below 7 nm in logic, memory or foundry, is required.
- Etch-tool qualification and plasma-process development and advanced-node POR establishment are required.
- Use CD-SEM, TEM, XPS, defect and etch-profile metrology and DOE and statistical analysis with JMP, Python or R.
- Collaborate proactively with lithography, etch, thin-film, integration and equipment teams.
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Checked 2026-10-19
TeslaSr. Process Engineer, Dry EtchStart a mock application