한국어·English
Tesla company · OPEN ROLE
- Company
- Make physical products work through software, factories, suppliers and service.
- Role
- Develop copper electroplating for interconnects/TSVs; optimize bath chemistry and void-free fill.
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What you will do
We rewrote the responsibilities and qualifications in plain language instead of copying the original posting.
Responsibilities
- Develop ECD for copper damascene and TSV fill and monitor bath health, defects and metrology.
- Optimize chemistry, current density, additives and annealing for void-free, low-stress copper fill at high aspect ratios.
- Develop and qualify electroless caps and barrier-free Co or Ru interconnect schemes.
- Qualify plating tools for production, including bath conditioning, anode management and process windows.
- Analyze process physics and lead root-cause analysis, inline metrology, SPC and yield improvement.
- Support round-the-clock manufacturing through rotations, on-call availability and urgent responses and develop next-generation materials and processes.
What you need
- A BS or MS in chemical engineering, materials science, electrical engineering or chemistry or a related technical field is required.
- At least five years of hands-on fab plating experience, especially below 7 nm in logic, memory or foundry, is required.
- ECD tool qualification and copper-plating development and advanced-node POR establishment are required.
- Use thickness, defect, TEM, XRF, resistivity and electrochemical metrology and DOE and statistical analysis with JMP, Python or R.
- Collaborate proactively with lithography, etch, thin-film, integration and equipment teams.
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Checked 2026-10-19
TeslaSr. Process Engineer, PlatingStart a mock application