한국어·English
ASML company · OPEN ROLE
- Company
- Turn a chipmaker’s process requirement into working lithography.
- Role
- Turn packaging requirements into roadmap priorities and customer validation.
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What you will do
We rewrote the responsibilities and qualifications in plain language instead of copying the original posting.
Responsibilities
- Build packaging and 3D integration expertise; translate customer technical requirements, performance targets and use cases into product roadmap priorities, system review and customer validation.
What you need
- More than five years of advanced-packaging process/integration engineering; technical bachelor/master with substantial experience or equivalent working/thinking level.
- Deep Advanced Packaging, 3D IC and Hybrid Bonding expertise; understanding of process flows, module interactions, customer roadmaps and technical-to-business translation.
- Proactive logical problem solving, strong English communication/presentation and relationships with customers and cross-functional partners.
- Legal authorization to access the controlled technology under US export rules is required before starting work.
Good to have
- Technical engineering experience is preferably in semiconductors; business administration or commercial education is optional.
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Checked 2026-10-19
ASML3D Integration & Advanced Packaging ExpertStart a mock application